Category Potting electronic components

The Similarities and Differences of Potting and Encapsulation

Potting and encapsulation are two processes that are used to insulate and protect electronic products. They are performed during the manufacturing process and help to keep dangerous substances out while also protecting against thermal shock and vibration. The equipment for potting and the equipment for encapsulation have similar processes, but work in different ways. Below we will take a look at both of the processes and their similarities and differences.

Potting Solutions

The potting system of coating and insulation involves the use of a shell that the device is placed in so that the liquid insulator can poured over into it. This process completely encases the unit and the case becomes a part of the finished product. Multiple types of materials are used for this process such as acrylics, silicone, and resin. The material used will depend on the product and the customer specifications, because different products require different levels of rigidity and protection.

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